Odisha Government signs $3.3 billion Memorandum of Understanding (MoU) with Intel Corporation (Intel) and 3D Glass Solutions Inc (3DGS)

Key facts

• The Odisha Government, Intel, and 3DGS signed a tripartite MoU to establish an advanced packaging glass core substrate manufacturing facility in the state.
• The proposed project involves an estimated investment of approximately $3.3 billion and will be located in the Bhubaneswar-Khurda region of Odisha.
• The facility will manufacture advanced packaging glass core substrates, high-density interconnect substrates, and related semiconductor components under the India Semiconductor Mission (ISM).
• The project is scheduled for implementation in phases over a period of five to six years and is expected to generate over 1,800 direct high-skilled jobs.
• Intel will provide technology expertise and process support for the facility, which aims to strengthen India’s participation in global semiconductor supply chains.