Science, Discovery, Tech and Environment · 2 January 2026
Ministry of Electronics and Information Technology (MeitY) advances semiconductor design through Design Linked Incentive (DLI) Scheme
Exam-focused facts from the 2 January 2026 current affairs briefing.
Key facts
- The Ministry of Electronics and Information Technology (MeitY) Design Linked Incentive (DLI) Scheme under the Semicon India Programme aims to build a self-reliant, globally competitive chip design ecosystem.
- As many as 24 DLI-supported chip design projects target strategic sectors, including video surveillance, drone detection, energy metering, microprocessors, satellite communications, and IoT SoCs.
- Projects supported under the government's DLI scheme are scaling rapidly, with 16 tape-outs, 6 ASIC chips, 10 patents, over 1,000 engineers engaged, and over 3x private investment leveraged.
- With an outlay of Rs 76,000 crore, the India Semiconductor Mission (ISM) supports investments in semiconductor and display manufacturing as well as the design ecosystem.
- C-DAC, a premier R&D organisation under MeitY, is responsible for implementing the DLI Scheme as the Nodal Agency.
- The DLI Scheme supports semiconductor design across the full lifecycle—from design and development to deployment—covering Integrated Circuits (ICs), chipsets, Systems-on-Chip (SoCs), systems and IP cores.