United States Department of State launches $200 million Edge AI Package for Indo-Pacific

Key facts

• The United States Department of State (US State Department) announced the Edge AI Package on 19 February 2026.
• The programme offers up to $200 million in competitive funding to support secure and affordable smartphones across the Indo-Pacific region.
• It is framed within the broader Pax Silica strategy launched in December 2025 to secure global AI and semiconductor supply chains.
• Pax Silica reportedly includes the United States, Japan and South Korea, with India set to join on 20 February 2026.
• Proposals are invited from Mobile Network Operators (MNOs) and Original Equipment Manufacturers (OEMs) for distributing low-cost, AI-ready smartphones in designated Indo-Pacific countries.
• Interested parties must email EdgeAI@state.gov to request technical requirements and the submission window remains open for 90 days.