Science, Discovery, Tech and Environment · 17 May 2026

Rajasthan's first semiconductor chip packaging facility inaugurated in Bhiwadi

Exam-focused facts from the 17 May 2026 current affairs briefing.

Key facts

  • Union Electronics and Information Technology Minister Ashwini Vaishnaw virtually inaugurated the state's first semiconductor plant and a new Electronics Manufacturing Cluster (EMC) at Bhiwadi, Rajasthan.
  • The Semiconductor ATMP/OSAT facility of Sahasra Semiconductors Pvt. Ltd. is India's first Small and Medium Enterprise-led unit to begin commercial production of semiconductor chips, set up with an investment of over ₹150 crore under the Ministry of Electronics and Information Technology (MeitY) SPECS scheme.
  • Spread across 57,000 square feet, the facility includes Class 10K and 100K cleanrooms and has an annual packaging capacity of 60 million semiconductor units, with plans to scale up to 400–600 million units annually over the next two to three years.
  • More than 60 per cent of its production is already being exported to markets including the United States, Germany, France, Eastern Europe, China and Nepal.
  • The Electronics Manufacturing Cluster (EMC) developed by ELCINA over 50.3 acres with a project cost of ₹46.09 crore (₹20.24 crore central support) has attracted planned investments of over ₹1,200 crore from 20 companies; operating companies include Aisan Fiem Industries, E-Pack Durable, Sahasra Electronics and Electronics Sector Skill Council of India.