Paras Defence to Set Up $644 Million Semiconductor Packaging Facility

Exam-focused facts from the 25 July 2026 current affairs briefing.

Key facts

Paras Defence and Space Technologies Limited announced a Rs 6,200 crore ($644 million) investment for a semiconductor unit through its wholly-owned subsidiary, Paras Semiconductors.
An MoU has been signed with the Madhya Pradesh State Electronics Development Corporation (MPSeDC) to build an Outsourced Semiconductor Assembly and Test (OSAT) facility.
The OSAT facility will be located on a 50-acre site along the Indore–Ujjain corridor in Madhya Pradesh.
The facility will undertake advanced chip packaging operations including 3D heterogeneous integration and 2.5D/3D advanced packaging.
The development aligns with the Union Cabinet-approved Rs 1.27 lakh crore budget for the India Semiconductor Mission (ISM 2.0), a six-year programme to accelerate India's semiconductor ecosystem.